The Lightwind L3 returns exactly the kind of data needed for effective process monitoring and FDC today. Based on breakthrough process control technology, the L3 enables users to:

• increase yields through fault prevention and detection, eliminating losses
• from scrapped wafers
• reduce consumable costs by optimizing process control
• minimize the number of chamber cleans (and increase yield) through endpoint detection

Through real-time, in-situ process and chamber monitoring, the L3 delivers a stable and rich data source, resulting in a comprehensive, always-on view of critical front-end semiconductor processes.

• Plasma deposition – chemical vapor deposition, physical vapor deposition and atomic layer deposition
• Plasma etching – covering etch chamber clean, chamber conditioning, tool wellness monitoring, chamber matching, endpoint detection and process monitoring/validation
• Photoresist strip – helps address challenges presented by new processes and materials, such as low-k dielectrics

The L3: A versatile tool

The L3 helps users

• Verify tool readiness:
  • for production
  • upon installation
  • after chamber seasoning
  • after cleaning
• Eliminate first wafer effects
• Repeatability
• Measure processes against a wellness fingerprint, in real time
• Conduct tool process diagnostics
• Detect effluent for environmental reasons
• Achieve superior endpoint control and selectivity
• Match processes for tool qualification and correlation
• Transfer processes using template

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